Cost per token is causing EDA design budgets to balloon; what comes next isn’t entirely clear yet. Discussions have shifted ...

Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) ...

A scalable LPDDR-based memory platform optimized for edge AI inferencing.

Increasingly complex chip designs require more test data than those developed at older nodes and on single planar dies. The ...

Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semiconductor ecosystem.

Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can ...

Just because a chip is deemed good doesn’t mean it will work as expected.

How advanced NoC architectures and coherent subsystem IP can address the industry's next-gen scalability, safety, and ...

First-silicon success falls; engineering capacity; minimum clock period; optimizing PyTorch; counterfeit electronics.

Researchers from the National University of Singapore developed an atom-thin film of amorphous carbon designed to insulate ...

Kilowatt-class AI accelerators are forcing engineers to rethink what counts as adequate coverage across workload, thermal behavior, test hardware, and time.

Several hurdles must be overcome for a combined hardware/software development flow. Structurally, teams remain independent, use different tools and languages, and work at a different cadence.