STOCKHOLM, SWEDEN – NCAB Group reported a 166% year-over-year increase in order intake for the third quarter of 2026, reaching approximately $263.9 million, as PCB material shortages and advance ...
The company also announced a $50 million investment to expand its existing operations in Kunshan, China, increasing its manufacturing capacity and strengthening its global production network.
BANNOCKBURN, IL – North American printed circuit board orders surged 229.4% year-over-year in September 2026, while shipments declined 6.4%. The industry's three-month book-to-bill ratio reached 1.77, ...
PEACHTREE CITY, GA – The Printed Circuit Engineering Association ( PCEA) today announced its Board of Directors for the 2027-28 term. Anaya Vardya, CEO of ASC Sunstone, will serve as chairman, with ...
MILPITAS, CA – Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), driven by demand for artificial intelligence infrastructure, memory devices ...
The course handbook, Printed Circuit Engineering Professional, was authored by Michael Creeden, Stephen Chavez, Rick Hartley, Susy Webb and Gary Ferrari, industry veterans who combined have more than ...
MALTA, NY -- GlobalFoundries plans to build and operate two new semiconductor fabrication plants at its Malta, NY, complex under a US-Japan trade and investment agreement that includes up to $21 ...
AUSTIN TX - High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s ...
BondFilm HF is for treatment of innerlayer cores. Reportedly offers low signal loss required in high-frequency applications. Requires reduced surface roughening, while maintaining excellent bond ...
Riston DI3000 multi-wavelength, dry-film photoresist is for pattern plating on multilayer printed circuit boards. Features high adhesion and chemical resistance delivers yield by eliminating lifting ...
AI-powered design assistant that extends agentic automation beyond chip development to PCB and advanced package design. Integrated within the Allegro AI Studio, AuraStack helps engineers streamline ...
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