Researchers have developed new polymer materials that are ideal for making the optical links necessary to connect chip-based photonic components with board-level circuits or optical fibers. These ...
Materials supplier Dow Corning Corp. has signed a joint development contract with Scotland's Invint Ltd. to develop advanced electronic interconnect materials, the two said today. Invint specializes ...
MANHASSET, N.Y. — More than 800 scientists and engineers working to solve interconnect wiring problems that are slowing development of faster, more powerful chips will gather next month at the eighth ...
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