United Parcel Service Inc. has acknowledged that its highly touted package-flow technology isn’t flowing as smoothly as expected, with problems at about a third of the 300 or so centers where it has ...
Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...
Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of ...
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