SEOUL, South Korea, July 14, 2025 /PRNewswire/ -- JNTC Co., Ltd. (KOSDAQ: 204270), a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, ...

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Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

Intel has announced a novel glass substrate designed for "next-generation advanced packaging, planned for the latter part of this decade." The company adds that the technology "will enable the ...

As transistors approach the sub-nanometer threshold, Moore’s Law certainly feels like it slowed down considerably. Chipmakers have been trying to find new materials that could allow transistor scaling ...

Glass-based substrates are slowly beginning to push out organic substrates – as also commonly used in PCBs – due to often superior material properties for packaging. One area where glass substrates ...

Intel Corp. will build glass into its most advanced processors to make them faster and more power-efficient. The chipmaker detailed the plan today ahead of its annual Intel Innovation event, which is ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--What’s New: Intel today announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.