TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its new NX-type full-SiC (silicon carbide) power semiconductor module for ...
Building upon Enecsys's ability to reliably scale power and reduce package size through its patented technology, the 250NL is 42% lighter and 48% less volume compared to the second generation product, ...
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