TOKYO, June 28, 2004 - Elpida Memory, Inc (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that has developed two new high-speed DRAM technologies ...

Groq reportedly plans 3D-stacked DRAM for its next LPU inference chip to expand memory capacity for trillion-parameter AI models.

NVIDIA-acquired firm Groq is reportedly planning to produce next-gen memory chips using 3D stacked DRAM technology.

TOKYO, Feb. 12, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge ...

Samsung said on Wednesday that it has developed an LPDDR5X DRAM that offers the industry's fastest speed at up to 10.7Gbps. The memory chip offers the lower power and high-performance requirement ...

Samsung said on Thursday that it has developed a new GDDR6 (graphics double data rate) DRAM with a data transfer rate of 24 gigabits per second (Gbps). A premium graphics card that packs the chips ...

Samsung Electronics has revealed that its latest LPDDR5X DRAM with the speed of 8.5 gigabits per second (Gbps) was validated for use on Snapdragon mobile platforms. By optimizing a high-speed signal ...

Fremont, Calif. – Graphics could be processed faster by breaking up the DRAM array into a bunch of smaller independent arrays with separate row and column decoders, Rambus engineers suggest. In a ...

SEOUL, July 6, 2020 — SK hynix Inc. (or ‘the Company,’ www.skhynix.com) announced that it has started the full-scale mass-production of high-speed DRAM, ‘HBM2E’, only ten months after the Company ...

The Teradyne Magnum E2 is a high-speed memory test system for advanced DRAM and flash interfaces. Its design, says the company, matches the test demands driven by AI and high-performance computing.