Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

A medical device's package plays a key role in safely delivering treatment to patients. It must ensure the integrity of the device from the point of manufacture to the point of final use. In addition, ...

ENCINITAS, CALIFORNIA / ACCESS Newswire / December 15, 2025 / Today, seven consumer-packaged-goods brands were named winners of the sixth-annual Designalytics Effectiveness Awards, as each ...