A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image ...

Figure1: Cross-section-TEM image of an active photodiode (PD) layer transferred to a model signal transfer device (labeled here as a "mount" device). Image taken before subsequent removal of cleave ...

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE (TM) Layer Transfer Process News provided by EIN Presswire Mar 02, 2023, 9:00 PM ET SiGen Extends Application ...

GalaxyCore has started production at its new 12-inch wafer plant in Lingang, Shanghai. It is yet another Chinese CMOS image sensor (CIS) maker to set up its wafer fab and shift toward integrated IC ...

According to industry sources, Apple is preparing to use an advanced image sensor in at least one of the iPhone 18 Pro’s ...

At least some of the camera sensors for the iPhone 18 Pro look set to be made in the USA, at a Samsung plant in Austin, Texas ...

Samsung is reportedly looking for project managers who will oversee the production of CIS for the iPhone 18 series.

Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...

Samsung Electronics plans to begin producing its in-house–designed high-performance CMOS image sensors (CIS) at its Austin, Texas, wafer fab in 2027 for Apple's iPhones. Industry analysts in South ...

A technical paper titled “Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout” was published by researchers at VTT Technical Research Centre of Finland and ...

Unterpremstaetten, Austria (November 30, 2011) – austriamicrosystems’ (SIX: AMS) Full Service Foundry business unit today released its further expanded fast and cost-efficient IC prototyping service, ...