Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed ...