Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking ...

Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon. “We already have very, ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

A new technical paper titled “Three-dimensional integrated metal-oxide transistors” was published by researchers at KAUST (King Abdullah University of Science and Technology). Find the technical paper ...

Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building ...

In recent years, research interest in the 3D printing of metal patterns on plastic parts has grown exponentially, due to its high potential in the manufacturing of next-generation electronics. But ...