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Scientists uncover hidden quantum trick in 2D materials
On October 21, 2025, scientists revealed a groundbreaking discovery in the realm of quantum physics: a hidden quantum trick ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...
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